Mechanic Heat Kit Intelligent Reflow Soldering Heating Platform
Designed for precision motherboard repairs, the Mechanic Heat Kit is an advanced heating platform tailored for iPhone X to 15 Pro Max models, offering intelligent, safe, and efficient reflow soldering and desoldering capabilities.
Key Features:
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Versatile Reflow Soldering Modes:
- 5 Professional Modes: Degumming, layering, lamination, tin planting, and welding.
- 3 Common Operation Modes: Easily switch between preset memory temperatures for frequent tasks.
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Advanced Heating Technology:
- Upgraded MCH Ceramic Double Heating Element: Faster, more uniform heating with enhanced stability compared to traditional single elements.
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Intelligent Temperature Control:
- Curve heating ensures safe and efficient soldering and desoldering without damaging the motherboard.
- Real-time Monitoring: Displays temperature changes and reflow soldering curves for precise control.
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Efficient Heat Dissipation:
- Built-in turbofan cooling system with adaptive speed ensures consistent heat management.
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User-Friendly Controls:
- Add Button: Adjust temperature or start heating (long press).
- Minus Key: Adjust temperature or start cooling (long press).
- MEM Key: Switch between 3 memory temperatures or set new memory values (long press).
- SET Button: Switch between 5 modes or set mode temperatures (long press).
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Wide Compatibility:
Supports motherboard repairs for:- iPhone X, XS, XS Max, 11, 11 Pro, 11 Pro Max
- iPhone 12 Mini, 12, 12 Pro, 12 Pro Max
- iPhone 13 Mini, 13, 13 Pro, 13 Pro Max
- iPhone 14, 14 Plus, 14 Pro, 14 Pro Max
- iPhone 15, 15 Plus, 15 Pro, 15 Pro Max
Specifications:
- Host Functions: Real-time temperature detection, memory, and operation mode settings.
- Heating Platform: Optimized for mobile motherboard soldering and desoldering tasks.
- Cooling System: Adaptive turbofan blades for effective heat dissipation.
Package Includes:
- 1 x Host
- 1 x Power Cord
- 6 x Heating Modules
- 17 x Steel Meshes
