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Cargue la imagen en el visor de la galería, [Amaoe] [Stencil] BGA Reballing Solder Paste Stencil For iPhone CPU Universal Soldering Mesh - Polar Tech Australia
Cargue la imagen en el visor de la galería, [Amaoe] [Stencil] BGA Reballing Solder Paste Stencil For iPhone CPU Universal Soldering Mesh - Polar Tech Australia
Cargue la imagen en el visor de la galería, [Amaoe] [Stencil] BGA Reballing Solder Paste Stencil For iPhone CPU Universal Soldering Mesh - Polar Tech Australia
Cargue la imagen en el visor de la galería, [Amaoe] [Stencil] BGA Reballing Solder Paste Stencil For iPhone CPU Universal Soldering Mesh - Polar Tech Australia
Cargue la imagen en el visor de la galería, [Amaoe] [Stencil] BGA Reballing Solder Paste Stencil For iPhone CPU Universal Soldering Mesh - Polar Tech Australia
Cargue la imagen en el visor de la galería, [Amaoe] [Stencil] BGA Reballing Solder Paste Stencil For iPhone CPU Universal Soldering Mesh - Polar Tech Australia
Cargue la imagen en el visor de la galería, [Amaoe] [Stencil] BGA Reballing Solder Paste Stencil For iPhone CPU Universal Soldering Mesh - Polar Tech Australia
Cargue la imagen en el visor de la galería, [Amaoe] [Stencil] BGA Reballing Solder Paste Stencil For iPhone CPU Universal Soldering Mesh - Polar Tech Australia
Cargue la imagen en el visor de la galería, [Amaoe] [Stencil] BGA Reballing Solder Paste Stencil For iPhone CPU Universal Soldering Mesh - Polar Tech Australia
Cargue la imagen en el visor de la galería, [Amaoe] [Stencil] BGA Reballing Solder Paste Stencil For iPhone CPU Universal Soldering Mesh - Polar Tech Australia
Cargue la imagen en el visor de la galería, [Amaoe] [Stencil] BGA Reballing Solder Paste Stencil For iPhone CPU Universal Soldering Mesh - Polar Tech Australia

[Amaoe] [Stencil] BGA Reballing Solder Paste Stencil For iPhone CPU Universal Soldering Mesh

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A solder paste stencil is a thin metal sheet, usually stainless steel, with laser-cut openings that correspond to the solder pads on a printed circuit board (PCB) designed for surface-mount technology (SMT). During the SMT assembly process, solder paste is applied through the stencil onto the PCB, creating deposits on the designated solder pads where the electronic components will be placed.

Here are some key points about solder paste stencils:

  • Function: They ensure precise solder application in the correct amount on designated locations on the PCB.
  • Benefits:
    • Accuracy and consistency across multiple boards.
    • Reduced rework due to misapplied solder paste.
    • Improved efficiency in the SMT assembly process.