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Cargue la imagen en el visor de la galería, Mechanic IX5 Mini Anti Tin-Blasting Thermostatic Preheating Platform For X-12PM (10-in-1)
Cargue la imagen en el visor de la galería, Mechanic IX5 Mini Anti Tin-Blasting Thermostatic Preheating Platform For X-12PM (10-in-1)
Cargue la imagen en el visor de la galería, Mechanic IX5 Mini Anti Tin-Blasting Thermostatic Preheating Platform For X-12PM (10-in-1)

Mechanic IX5 Mini Anti Tin-Blasting Thermostatic Preheating Platform For X-12PM (10-in-1)

Precio regular $65.00 AUD
Precio de venta $65.00 AUD Precio regular
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Mechanic IX5 Mini Anti Tin-Blasting Thermostatic Preheating Platform

US Plug, Compatible with iPhone X, XS, XS Max, 11, 11 Pro, 11 Pro Max, 12, 12 Pro, 12 Pro Max, and 12 Mini


Product Features:

  1. Unique Edge-Sealing Insulation Design:
    Ensures rapid tin melting in the middle layer while protecting the motherboard.

  2. Efficient and Non-Destructive Operation:
    Facilitates seamless layering and bonding without damaging delicate components.

  3. Double-Layer Motherboard Compatibility:
    Specifically designed for layering and bonding tasks on double-layer iPhone motherboards.

  4. Host-Free, Air Gun-Free, Soldering Iron-Free:
    Achieves accurate layering and bonding within three minutes, eliminating the need for additional tools while maintaining motherboard integrity.

  5. Plug-and-Play Design:
    Supports easy assembly and disassembly, streamlining repair workflows and saving valuable time.

  6. Preheating Temperature:
    Set at an optimal range of 180-190°C, ensuring safe and efficient preheating for desoldering and bonding tasks.


Specifications:

  • Compatibility:
    • Apple iPhone X, XS, XS Max
    • iPhone 11, 11 Pro, 11 Pro Max
    • iPhone 12, 12 Pro, 12 Pro Max, 12 Mini
  • Package Weight: 0.32 kg (0.71 lb)
  • Package Dimensions: 15 cm x 12 cm x 6 cm (5.91 in x 4.72 in x 2.36 in)
  • Carton Details:
    • Quantity per Carton: 45 units
    • Carton Weight: 14.04 kg (30.95 lb)
    • Carton Size: 47 cm x 38 cm x 32 cm (18.5 in x 14.96 in x 12.6 in)

Applications:

  • Ideal for iPhone motherboard layering, bonding, and soldering tasks.
  • Prevents tin-blasting and protects sensitive components during repairs.