[RL-088] RELIFE Tin Plant Universal Fixture Double Use with Magnetic Adsorption

Material and Construction:

• Anti-static: Helps prevent electrostatic discharge (ESD) that could damage delicate electronic components.
• Strong magnetic adsorption: Likely features embedded magnets for holding the platform securely in place during soldering work.
• High-temperature resistance: Made from materials that can withstand high soldering temperatures without melting or warping.
• Steel plate weight gain: This phrasing is a bit unclear, but it might indicate a baseplate made of steel for added stability and heat distribution.
• Chemical corrosion resistance: The materials used are likely resistant to corrosion from soldering fluxes and other chemicals used in electronics repair.
• New high-temperature silicone material: This suggests the platform might incorporate silicone elements that can withstand high temperatures without deforming or degrading.
• Flame retardant: An important safety feature, indicating the platform resists catching fire during soldering work.

Applications:

• Suitable for repairing motherboards of different shapes: The platform's design likely allows for some flexibility to accommodate various motherboard shapes and sizes.
• General tin planting of BGA chips: BGA (Ball Grid Array) chips are commonly used on motherboards. Tin planting refers to applying a thin layer of solder to the chip's contact points. This platform might provide a stable surface for this process.
• Double-sided and double-use: This suggests the platform can be used in different orientations or configurations depending on the soldering task.