Mechanic Heat Air Desoldering Station Molds

Mechanic Heat Air Desoldering Station Molds

Description:

The Mechanic Heat Air Desoldering Station Molds are specially designed to enhance the functionality of Mechanic heating platforms, making them indispensable for professional motherboard repair tasks. These molds are compatible with a wide range of iPhone models and include dedicated reballing stencils for precise soldering on the middle layer of the motherboard.

Features:

1. Wide Compatibility:
   Supports motherboard repair for the following iPhone models:

   • iPhone X, XS, XS Max, 11, 11 Pro, 11 Pro Max
   • iPhone 12 Mini, 12, 12 Pro, 12 Pro Max
   • iPhone 13 Mini, 13, 13 Pro, 13 Pro Max
   • iPhone 14, 14 Plus, 14 Pro, 14 Pro Max
   • iPhone 15, 15 Plus, 15 Pro, 15 Pro Max

2. Precision Reballing Stencils:

   • Includes a set of matching reballing stencils for soldering the motherboard's middle layer.
   • Ensures accurate and efficient tin planting for repairs and reassembly.

3. Optimized for Heating Platforms:

   • Fully compatible with Mechanic Heat Air Desoldering Stations.
   • Designed for seamless integration with heating platforms for reliable performance during degumming, layering, and reflow soldering tasks.

Applications:

These molds, combined with reballing stencils, allow technicians to:

• Perform precise tin planting for motherboard middle layers.
• Handle advanced tasks such as desoldering, soldering, and reassembly with ease.
• Expand the capabilities of existing heating platforms for a complete repair solution.