Mechanic IX5 Mini Anti Tin-Blasting Thermostatic Preheating Platform
US Plug, Compatible with iPhone X, XS, XS Max, 11, 11 Pro, 11 Pro Max, 12, 12 Pro, 12 Pro Max, and 12 Mini
Product Features:
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Unique Edge-Sealing Insulation Design:
Ensures rapid tin melting in the middle layer while protecting the motherboard. -
Efficient and Non-Destructive Operation:
Facilitates seamless layering and bonding without damaging delicate components. -
Double-Layer Motherboard Compatibility:
Specifically designed for layering and bonding tasks on double-layer iPhone motherboards. -
Host-Free, Air Gun-Free, Soldering Iron-Free:
Achieves accurate layering and bonding within three minutes, eliminating the need for additional tools while maintaining motherboard integrity. -
Plug-and-Play Design:
Supports easy assembly and disassembly, streamlining repair workflows and saving valuable time. -
Preheating Temperature:
Set at an optimal range of 180-190°C, ensuring safe and efficient preheating for desoldering and bonding tasks.
Specifications:
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Compatibility:
- Apple iPhone X, XS, XS Max
- iPhone 11, 11 Pro, 11 Pro Max
- iPhone 12, 12 Pro, 12 Pro Max, 12 Mini
- Package Weight: 0.32 kg (0.71 lb)
- Package Dimensions: 15 cm x 12 cm x 6 cm (5.91 in x 4.72 in x 2.36 in)
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Carton Details:
- Quantity per Carton: 45 units
- Carton Weight: 14.04 kg (30.95 lb)
- Carton Size: 47 cm x 38 cm x 32 cm (18.5 in x 14.96 in x 12.6 in)
Applications:
- Ideal for iPhone motherboard layering, bonding, and soldering tasks.
- Prevents tin-blasting and protects sensitive components during repairs.