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US Plug, Compatible with iPhone X, XS, XS Max, 11, 11 Pro, 11 Pro Max, 12, 12 Pro, 12 Pro Max, and 12 Mini
Unique Edge-Sealing Insulation Design:Ensures rapid tin melting in the middle layer while protecting the motherboard.
Efficient and Non-Destructive Operation:Facilitates seamless layering and bonding without damaging delicate components.
Double-Layer Motherboard Compatibility:Specifically designed for layering and bonding tasks on double-layer iPhone motherboards.
Host-Free, Air Gun-Free, Soldering Iron-Free:Achieves accurate layering and bonding within three minutes, eliminating the need for additional tools while maintaining motherboard integrity.
Plug-and-Play Design:Supports easy assembly and disassembly, streamlining repair workflows and saving valuable time.
Preheating Temperature:Set at an optimal range of 180-190°C, ensuring safe and efficient preheating for desoldering and bonding tasks.
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